Amount
Full — tuition + living + internship + job placement
Deadline
30 April 2026
Study
Local
Bond
Yes — bond to serve Gamuda Group upon graduation
Eligibility
Grades: Min CGPA 3.40 / 3As in STPM or equivalent; strong leadership
Who: Open to all Malaysians
Study level:
PreUUndergrad
Qualifications:
A-LevelDiplomaFoundationIBMatriculationSTPMUEC
Fields:
BusinessEngineeringITSTEM
Notes
Running since 1996 — over 640 scholars. Covers top public/private universities and branch campuses. Engineering fields: Civil, Electrical, Electronics, Mechanical, Mechatronics. Also QS, Architecture, Urban Planning, Property, Accounting, HR, Business IT, Psychology. Internship and structured job placement at Gamuda Group. UEC accepted. Financial need required. Apply via gamuda.com/scholarship.